About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXV
|
| Presentation Title |
Investigation of Interfacial Reactions of Sn-xZn Solders With Cu-2.3 wt.% Fe (C194) Substrate at 270<sup>o</sup>C |
| Author(s) |
Mavindra Ramadhani, Yee wen Yen |
| On-Site Speaker (Planned) |
Mavindra Ramadhani |
| Abstract Scope |
The interfacial reactions in the Sn-xZn solders (x = 1, 3, 5, 7, and 9 wt%)/Cu-2.3 wt.% Fe (C194) couples at 270<sup>o</sup>C were investigated. The results revealed that the (Cu, Sn)Zn and (Cu, Zn)<sub>6</sub>Sn<sub>5</sub> phases were formed in the Sn-1ZSn/C194 and Sn-3Zn/C194 couples. When the Zn contents were increased to 5, 7, and 9 wt% Zn, only the γ-Cu<sub>5</sub>Zn<sub>8</sub> phase was formed at the Sn-Zn/C194 interface. The d (IMC thickness) vs. t<sup>n</sup> (reaction time) for each reaction couple was plotted. The results show that the IMC growth mechanism is lattice diffusion-controlled in the Sn-3Zn/C194 couple and grain boundary diffusion-controlled for IMC in other couples. Our current study results reveal that the formation of IMCs in the Sn-xZn/C194 systems is very sensitive to the concentration of Zn in the Sn-xZn solder systems. The electronics industry must strictly control the Zn concentration to ensure the solder-joint reliability. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Phase Transformations, Electronic Materials, Other |