About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXV
|
| Presentation Title |
How to Design Sn-In-X low-Temperature Solder With High Strength |
| Author(s) |
Hao-Wei Kuo, Yu-chen Liu |
| On-Site Speaker (Planned) |
Hao-Wei Kuo |
| Abstract Scope |
The development of flexible electronic devices has exposed the limitations of brittle Sn–Bi solder and highlighted the need for alternatives: Sn–In alloys offer improved ductility but exhibit low mechanical strength. Prior studies enhanced Sn–In systems by adding individual elements (e.g., Cu, Ag, Zn), but the combined effects of multiple dopants have not been systematically explored. We therefore built a Vickers hardness database covering Sn–In–X compositions (where X includes Cu, Ag, Zn, Bi, Sb, Al, and Ni) and applied Gaussian kernel ridge regression with a genetic algorithm to inversely design optimal alloys. Experimental validation showed that our SIX alloy delivers superior strength compared to the Sn–52 wt.% In alloy. This methodology offers a rapid pathway to engineer advanced low-temperature solders for flexible electronics and high-density packaging. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Machine Learning, |