About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXV
|
| Presentation Title |
Indentation-Based Insights Into the Mechanical Reliability of Silicon for High-Temperature Microelectronic Applications |
| Author(s) |
Verena Maier-Kiener, Daniel Tscharnuter, Peter Imrich, Gerald Schaffar |
| On-Site Speaker (Planned) |
Verena Maier-Kiener |
| Abstract Scope |
This presentation focuses on phase transformations in silicon revealed through high-resolution nanoindentation techniques and their interplay with high-temperature deformation behavior. Using a novel unloading contact pressure approach with continuous stiffness measurement (CSM), pressure-induced phase transitions during indentation are investigated with improved precision. The method enables direct calculation of mean contact pressure during unloading and reveals the influence of load-holding segments on transformation onset, aligning well with high-pressure literature data, and was confirmed by Raman spectroscopy. To contextualize these findings, complementary high-temperature nanoindentation studies are discussed. In monocrystalline (100) silicon, a transition from phase transformation to dislocation-controlled plasticity occurs between 300 °C and 400 °C, with further changes above 800 °C. Additionally, spherical nanoindentation on a 1.2 μm silicon film at 500 °C and 700 °C extracts stress-strain behavior, confirming thermally activated dislocation glide. Together, these results provide a comprehensive view of silicon’s mechanical response, bridging nanoscale phase transformation analysis with bulk high-temperature deformation mechanisms. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Mechanical Properties, Phase Transformations, Other |