About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXV
|
| Presentation Title |
Investigation of Bonding Strength in Cu/Sn/Cu Thermocompression Using a Bi-Layer Diffusion Barrier of Zr-Based Thin Film Metallic Glass |
| Author(s) |
Zhen-Yi Wu, Kai-An Yang, Ming-Tzer Lin, Chi-Hang Lin, Ya-Han Ye, Zhu-Yuan Zhao |
| On-Site Speaker (Planned) |
Zhen-Yi Wu |
| Abstract Scope |
This study investigates the Zr₆₉Cu₂₄Ti₇/Cu diffusion barrier structure on the growth behavior of intermetallic compounds (IMC) and mechanical properties in Cu/Sn/Cu bonding structures for integrated circuit packaging. A thin film metallic glass (TFMG) composed of Zr₆₉Cu₂₄Ti₇ was employed as a diffusion barrier, with an additional thin Cu layer deposited on top to promote the formation of an appropriate amount of Cu–Sn intermetallic compounds. The Cu/Zr-TFMG/Cu/Sn multilayer structure was bonded to its counterpart via thermo-compression bonding, and the evolution and growth mechanisms of IMC such as Cu₆Sn₅ and Cu₃Sn were examined under various bonding temperatures, applied pressures, cooling rates, and aging conditions. Shear tests were performed using a tensile testing machine to apply shear stress on the bonded samples and determine the joint strength. The results demonstrate enhanced mechanical strength and thermal stability of the joints, supporting the potential of TFMG/Cu as an effective diffusion barrier in IC packaging applications. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Joining, Electronic Materials, Mechanical Properties |