About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXV
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| Presentation Title |
Effects of Minor Ga Addition to Sn and SnAgCu Solders on the Microstructure Evolution of Solder Joints |
| Author(s) |
Po Sen Cheng, Yiwun Wang |
| On-Site Speaker (Planned) |
Po Sen Cheng |
| Abstract Scope |
The aim of this study is to investigate the effects of gallium (Ga) addition on solder modification. The first part of this experiment focuses on adding trace amounts of to pure Sn solder and comparing it with pure Sn solder. The solders were joined with Ni substrate at 250°C for different reaction time.In the second part of the experiment, trace amounts of Ga addition to SnAgCu solder in the reactions between Cu and Ni substrates at 250°C reflow. The samples were then subjected to heat treatment in silicone bath at different temperatures for various durations. The samples were mounted in epoxy resin after reaction. The specimens were ground and polished with SiC and Al2O3. SEM was used to observe the interfacial microstructure, and EPMA point analysis was conducted to analyze the elemental composition at the interface. The results show that Ga addition obviously inhibits intermetallic compounds growth.
Keywords：Ga, Modification, Interfacial Microstructure, Intermetallic Compounds |
| Proceedings Inclusion? |
Planned: |