About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXV
|
| Presentation Title |
Electrochemical Co-Deposition of Copper-Silver Foil for Copper-Copper Thermocompression Bonding |
| Author(s) |
Yu-Ju Li, Chih-Ming Chen |
| On-Site Speaker (Planned) |
Yu-Ju Li |
| Abstract Scope |
Efficient integration of multi-functional IC chips within a reduced-volume packaging structure is essential to advance the semiconductor development, and three-dimensional (3D) IC technology is a promising method to achieve this goal. Cu-Cu direct bonding is crucial to construct 3D IC architecture. In this study, electrochemical co-deposition of copper-silver foil was developed for Cu-Cu direct bonding. Mechanical hardness of the Cu-Ag film (5.3 at% Ag) was observed, achieving 1.72 GPa as compared to pure Cu (1.64 GPa). The Cu-Ag film exhibited a resistance of 2.3 ×10-6 Ω cm, slightly higher than pure Cu (1.6 ×10-6 Ω cm) but an acceptable electrical conductivity (70.9% IACS). Direct bonding of two Cu-Ag co-deposited films was performed by thermocompression (10 MPa ) at 250 ℃ for 30 min. The bonding interface of two Cu-Ag co-deposited films was microstructurally examined and a systematic comparison with pure Cu films was made to realize the effect of Ag. |
| Proceedings Inclusion? |
Planned: |