About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXV
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| Presentation Title |
CALPHAD-Assessment of Bi-Cu-Sn and Bi-Cu-Te Ternary Systems |
| Author(s) |
Cheng-Hsi Ho, Hsin-Chieh Huang, Yung-Chun Tsai, Sinn-wen Chen |
| On-Site Speaker (Planned) |
Cheng-Hsi Ho |
| Abstract Scope |
Bi-Cu-Sn and Bi-Cu-Te ternary systems play a crucial role in thermoelectric and lead-free solder applications. Phase diagrams provide fundamental information about the material systems. This study determined the CALPHAD-type phase diagrams of Bi-Cu-Sn and Bi-Cu-Te ternary systems, assisted with experimental data. Liquid demixing occurs in the Bi-Cu-Sn ternary system, which is not present in the binary subsystems. Ternary parameters are introduced in the liquid phase to reproduce the monotectic reaction temperatures and the primary solidification phases from the experimental data. In the Bi-Cu-Te ternary system, a liquid miscibility gap is found at the Cu-rich side, which is extended from the Cu-Te binary subsystem. The calculation results agreed well with the experimental data, especially those related to the invariant temperatures. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Phase Transformations, |