About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXV
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| Presentation Title |
Interfacial Reactions between Ga-Added Lead-Free Solder and Cu Substrate |
| Author(s) |
Wei-Lun Chen, Yi-Wun Wang |
| On-Site Speaker (Planned) |
Wei-Lun Chen |
| Abstract Scope |
Due to the restrictions imposed by the RoHS directive, lead-containing solders such as Sn-Pb solder can no longer be used. As a result, research has shifted toward the development of lead-free solders. The experiment was conducted by using Sn-xGa and SnIn-xGa solders reacted with Cu after reflow and aging reactions. The primary intermetallic compound formed at the interface is Cu₉(Sn,Ga)₄. The thickness of the intermetallic compounds increases with reaction time. Minor Ga addition can inhibit intermetallic compounds growth. This study investigates how the growth of Cu₉(Sn,Ga)₄ is affected by the duration of bonding and compares the intermetallic thickness with and without Ga addition in the solder.
Keywords: Lead-Free Solder, Cu₉(Sn,Ga)₄, Ga, |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Phase Transformations, |