About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
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| Symposium
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Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXV
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| Presentation Title |
The Effect of In Concentration and Temperature on Dissolution and Precipitation in Sn-Bi Alloys |
| Author(s) |
Qichao Hao, Xin Fu Tan, Qinfen Gu, Jiye Zhou, Keith Sweatman, Tetsuro Nishimura, Stuart McDonald, Kazuhiro Nogita |
| On-Site Speaker (Planned) |
Qichao Hao |
| Abstract Scope |
Low-temperature Sn-Bi solder alloys are widely used in electronics but face challenges due to microstructural and crystallographic changes during service. A key factor is the temperature-dependent solubility of Bi in the Sn phase. This study investigates the effect of indium (In) additions on Bi dissolution using in-situ heating synchrotron powder X-ray diffraction (PXRD) on Sn-57Bi-xIn (x = 0.2, 0.5, 1, and 3 wt%) alloys. The results revealed that introduction of In to the alloy can change the lattice parameters of the Sn and promotes the dissolution of Bi in the Sn phase. In addition, there is an alloy dependent temperature, above which the dissolution speed of Bi in Sn increases significantly and additions of In lower this temperature. These findings provide new insights into Bi behavior in the Sn matrix and highlight In’s role in enhancing the thermal stability and reliability of Sn-Bi solder alloys for advanced electronic applications. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, |