About this Abstract |
Meeting |
2024 TMS Annual Meeting & Exhibition
|
Symposium
|
Refractory Metals 2024
|
Presentation Title |
Utilizing Grain Boundary Segregation Engineering for Nanostructured Tungsten Thin Films |
Author(s) |
Julius Keckes, Markus Alfreider, Michael Wurmshuber, Anna Hirle, Stefan Wurster, Helmut Riedl, Daniel Kiener |
On-Site Speaker (Planned) |
Julius Keckes |
Abstract Scope |
Enhancing the mechanical properties of tungsten is crucial for its deployment in extreme environments, such as divertors in fusion devices. The semi-brittle mechanical behavior poses a challenge for such applications, with grain boundaries often being the weakest link, leading to intercrystalline fracture. Here, nanostructured tungsten thin films are synthesized using magnetron sputtering, additionally containing segregating elements intended for enhancing grain boundary cohesion. The sputtered thin films exhibit tens of nanometer-sized grains, thereby featuring a high amount of grain boundaries while exhibiting very limited intergranular plasticity, thus emphasizing the effects of segregating elements on grain boundary cohesion. Microstructure and chemistry are characterized using electron microscopy methods. Mechanical properties are investigated by preparation of microsamples by a focused ion beam workstation, with subsequent in-situ testing in the scanning electron microscope. This allowed identification of particularly effective elements for grain boundary segregation strengthening and a comparison to bulk doped ultra-fine grained tungsten. |
Proceedings Inclusion? |
Planned: |
Keywords |
Thin Films and Interfaces, Mechanical Properties, Characterization |