| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Nano and Micro Additive Manufacturing
|
| Presentation Title |
Microscale 3D Deposition of Metals by Solid-state Kinetic Bonding |
| Author(s) |
Alain Reiser, Christopher Schuh |
| On-Site Speaker (Planned) |
Alain Reiser |
| Abstract Scope |
Solid-state bonding of metals by severe deformation enables high-performance macroscale manufacturing technologies such as friction-stir welding, cold spray or explosion welding. High-quality bonds with wrought microstructures and no heat-affected zones are some of the advantages over thermal joining technologies. The bonding principle promises to be translatable to microscale AM—a domain where wrought microstructures are currently unavailable but desired because of their high density and strength. Here we present a microscale AM approach based on the laser-induced forward transfer and kinetic bonding of metal microparticles. Solid metal particles are accelerated to supersonic velocities via laser-ablation and bond to the underlying substrate upon impact. We discuss the 3D deposition of structures built from microscale particles and present a first analysis of microstructure. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Additive Manufacturing, Process Technology, |