| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Nano and Micro Additive Manufacturing
|
| Presentation Title |
Direct Out-of-plane Writing of Metals on Insulators by Electron-beam-enabled Electrodeposition with Submicrometer Feature Size |
| Author(s) |
Mirco Nydegger, Ralph Spolenak, Alain Reiser |
| On-Site Speaker (Planned) |
Mirco Nydegger |
| Abstract Scope |
In this talk, we present an approach for localized electroplating on insulators, enabling the additive fabrication of out-of-plane, sub-micro-scale metal structures on various substrates inside an environmental SEM. Our strategy is based on a combination of electrohydrodynamic ejection for nanoscale confinement of electrolyte and e-beam assisted electrodeposition. Previously, the requirement for electron transfer from a conductive substrate has limited the choice of substrates in electrochemical electrohydrodynamic printing (EHD redox printing)—a limitation we now circumvent by electron-beam-induced reduction. Our experimental results demonstrate successful deposition on substrates ranging from electrically conductive (gold) to insulating (Al2O3, glass) and flexible materials (polyethylene). Furthermore, this hybrid technique allows for in-situ e-beam observation of the electroplating process. By expanding the selection of substrates and providing real-time monitoring capabilities, this advancement holds potential for applications requiring precise and controlled metal 3D deposition at the sub-micro-scale. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Additive Manufacturing, Nanotechnology, |