About this Symposium |
Meeting |
2024 TMS Annual Meeting & Exhibition
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Symposium
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Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXIII
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Sponsorship |
TMS Functional Materials Division TMS: Alloy Phases Committee
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Organizer(s) |
Yu-Chen Liu, National Cheng Kung University Hiroshi Nishikawa, Osaka University Shih-kang Lin, National Cheng Kung University Chao-hong Wang, National Chung Chung University Chih-Ming Chen, National Chung Hsing University Jaeho Lee, Hongik University Zhi-Quan Liu, Shenzhen Institutes of Advanced Technology Ming-Tzer Lin, National Chung Hsing University Yee-wen Yen, National Taiwan University of Science and Technology A.S.Md Abdul Haseeb, Bangladesh University of Engineering and Technology (BUET) Ligang Zhang, Central South University Sehoon Yoo, KITECH Ping-Chuan Wang, SUNY New Paltz Yu-An Shen, Feng Chia University |
Scope |
This is the 23nd in a series of TMS symposia addressing the stability, transformation, and formation of phases during the fabrication, processing, and utilization of electronic materials and devices. Topics of interests range from microelectronic technologies to advanced energy technologies, including phase stability, transformation, formation, and morphological evolution of electronic packaging materials, interconnection materials, integrated circuit materials, optoelectronic materials as well as energy storage and generating materials. |
Abstracts Due |
07/15/2023 |
Proceedings Plan |
Planned: |