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About this Symposium
Meeting 2024 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXIII
Sponsorship TMS Functional Materials Division
TMS: Alloy Phases Committee
Organizer(s) Yu-Chen Liu, National Cheng Kung University
Hiroshi Nishikawa, Osaka University
Shih-kang Lin, National Cheng Kung University
Chao-hong Wang, National Chung Chung University
Chih-Ming Chen, National Chung Hsing University
Jaeho Lee, Hongik University
Zhi-Quan Liu, Shenzhen Institutes of Advanced Technology
Ming-Tzer Lin, National Chung Hsing University
Yee-wen Yen, National Taiwan University of Science and Technology
A.S.Md Abdul Haseeb, Bangladesh University of Engineering and Technology (BUET)
Ligang Zhang, Central South University
Sehoon Yoo, KITECH
Ping-Chuan Wang, SUNY New Paltz
Yu-An Shen, Feng Chia University
Scope This is the 23nd in a series of TMS symposia addressing the stability, transformation, and formation of phases during the fabrication, processing, and utilization of electronic materials and devices. Topics of interests range from microelectronic technologies to advanced energy technologies, including phase stability, transformation, formation, and morphological evolution of electronic packaging materials, interconnection materials, integrated circuit materials, optoelectronic materials as well as energy storage and generating materials.
Abstracts Due 07/15/2023
Proceedings Plan Planned:
PRESENTATIONS APPROVED FOR THIS SYMPOSIUM INCLUDE

A-27: Co/Bi2(Se,Te)3 Interfacial Reactions and Bi-Co-Se-Te Phase Equilibria
A-28: Cu Surface Protection Treatments for Anti-oxidation and Anti-corrosion
A-29: Efficiency Enhancement of P-I-N Perovskite Solar Cells by Self-assembled Silane Treatment of Hole Transporting Layer
A-30: Electric Current-induced Unexpected Phase Transition for the ƞ'-Cu6Sn5 Phase at Low Temperatures
A-31: Impurity Effects on Interfacial Reactions between Sn-Zn-based Solders and Electroplated Cu Films
A-32: Silver Nanoparticles Modified Polyimide Covalent Organic Frameworks Composites for Dye-sensitized Solar Cells
A-33: Study on the Stability of the Synergistic Inhibition Effect of Metal Ions and Nitrides on Copper Corrosion
A Comprehensive Study of Microstructure, Texture, and Properties Evolutions in Pure Metals Induced by Electric Current Stressing
A Rapid Interconnection Technique via Solder/Porous Structures under FA Atmosphere
Active Metal Brazing for Fabricating Cu/Si3N4/Cu Substrates with Ag-Cu-Ti Pastes
Ag and Cu Whiskers in the Ag-Cu-Se Ternary System
Bonding Strength of ENIG Joint Using Micro-sized Ag Particles with Submicron Ceramic Particles
Effective Suppression of Boron Dopant on the Interfacial Reactions of Electroplating Co(B) Deposits and Lead-free Solders
Effects of Bi and In on the Growth of Intermetallic Compounds
Effects of Storage Time on the Growth of Cu(In,Sn)2
Electric Current Effects on Stability and Mechanical Properties of Monoclinic Cu6Sn5 Phase Based on In-situ Nanoindentation
Electrochemically Based and Coupled Approaches for Tracking Phase Transformations in Energy Storage Materials
Evolution of Vibrational Modes during Antiferrodistortive Phase Transition in SrTiO3
Exploration of Gel Hardness by Using Machine Learning Method
Growth Kinetics and Morphological Evolution of Compounds in Cu-eutectic Sn-Bi Alloy System with Ag and Ni
Improvement of Microelectronic Joint Reliability through the Optimization of IMC Nanomechanical Properties
Improving Mechanical Properties of Eutectic Sn-Zn Low-Melting Alloy by Indium Addition
In-situ Study of Phase Transformation and Strain Localization in Multi-phase Alloys
Interfacial Reaction in the Liquid/Solid Lead-free Solder/Cu-Ni-Si-Mg Alloy (C7025) Couples
Microalloying-induced Structural Transformation and Mechanical Improvement in Promising Electronic Packaging Materials
Microstructure and Strength of Sn-Ag-Cu Solder Joint Using Blue Diode Laser
Phase Equilibrium of Cu-Sn-Ti Ternary System at 450 ℃
Phase Stability and Binodal/Spinodal Decomposition of Ag- and S-alloyed CIGS Absorbers: An Ab Initio-assisted CALPHAD Study with Key Experiments
Properties and Phase Transformations of Manganese Oxides for Environmentally Friendly Batteries
Superplasticity Deformation of Sn-Bi Based Solder Alloys
The Effect of Nitrogen on the Stability of the β Phase in W Thin Films during Thermal Annealing
The Effect of Nitrogen on Thermomechanical Behavior during the β-α Phase Transformation in W Thin Films
X-ray Diffraction on Solder-related Intermetallic Phases


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