| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXIII
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| Presentation Title |
Growth Kinetics and Morphological Evolution of Compounds in Cu-eutectic Sn-Bi Alloy System with Ag and Ni |
| Author(s) |
Minho Oh, Yuki Tanaka, Equo Kobayashi |
| On-Site Speaker (Planned) |
Minho Oh |
| Abstract Scope |
This study investigated the growth kinetics and rate-controlling processes of intermetallic layers between Cu and Sn-58wt.% Bi alloys with Ag and Ni. The diffusion couples were isothermally annealed at the solid-state temperatures for various times up to 384 h. The intermetallic layer consists of irregularly scalloped Cu6Sn5 and uniformly thin Cu3Sn formed at the interface. Isothermal sections of the ternary Bi-Cu-Sn system were calculated using a CALPHAD method, revealing the diffusion path passing through the Cu6Sn5 and Cu3Sn phases. The layer growth was controlled by boundary diffusion, with grain growth as the dominant growth mechanism based on the experimental observation. The morphological evolution of the intermetallic compound and the widening of the Sn-Bi eutectic microstructure were observed. Furthermore, the activation enthalpy for the layer growth by boundary diffusion with grain growth was determined, providing insights into the energy barrier for atomic diffusion across the interface. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Joining, Electrometallurgy, Phase Transformations |