| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXIII
|
| Presentation Title |
Improvement of Microelectronic Joint Reliability through the Optimization of IMC Nanomechanical Properties |
| Author(s) |
Jenn-Ming Song |
| On-Site Speaker (Planned) |
Jenn-Ming Song |
| Abstract Scope |
3D IC integration and power device packaging are both important issues in microelectronic assembly. For these applications, the main constituent phase of the solder joints might be intermetallic compounds (IMCs). IMCs formed at solder joint interface have long been regarded playing an important role in joint reliability, especially when suffering high speed deformation. In this talk, mechanical properties of IMCs at joint interface investigated using nanoindentation will be introduced. Dependences of strain rate, growth texture of IMCs, and allotropic transitions on nanoindentation responses will be discussed. The relationships between mechanical behavior of IMCs, fracturing modes and impact toughness of solder joints subject to microimpact testing will also be clarified. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Joining, Phase Transformations, Mechanical Properties |