| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXIII
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| Presentation Title |
Interfacial Reaction in the Liquid/Solid Lead-free Solder/Cu-Ni-Si-Mg Alloy (C7025) Couples |
| Author(s) |
Yu-Cheng Jhen, Yi-Chin Liou, Andromeda Dwi Laksono, Yee-Wen Yen |
| On-Site Speaker (Planned) |
Yu-Cheng Jhen |
| Abstract Scope |
In this study, interfacial reactions in the three types of lead-free solders (LFS): Sn, SAC, and SC reacting with Cu-3.0 wt%Ni-0.65 wt%Si-0.15 wt%Mg alloy (C7025) were investigated. The liquid/solid reaction couple was used and LFS/C7025 couples were reacted at 240, 255, and 270°C for 0.5 to 20 h. The scallop-shaped (Cu,Ni)6Sn5 phase was formed in all couples and its thickness was increased with the increase of reaction times and temperatures. The Cu3Sn phase was formed at higher temperature and longer reaction time. After the 10 h-heat-treatment, the Cu3Sn phase was formed in the Sn/C7025 couples reacted at 240, 255°C, and at 270°C for 5 h. The Cu3Sn phase was formed in the SAC/C194 and SC/C194 couples at 270°C for 2 h. The Ni could inhibit the Cu3Sn phase growth. The total IMC growth mechanism was diffusion controlled in all LFS/C7025 couples. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Joining, Other |