About this Abstract |
Meeting |
2024 TMS Annual Meeting & Exhibition
|
Symposium
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Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXIII
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Presentation Title |
A-31: Impurity Effects on Interfacial Reactions between Sn-Zn-based Solders and Electroplated Cu Films |
Author(s) |
Fang-Yu Chen, Chang-Ying Lin, Chih-Ming Chen, Yu-An Shen |
On-Site Speaker (Planned) |
Fang-Yu Chen |
Abstract Scope |
The formation of voids is a critical issue that significantly affects the reliability of solder joints. In addition to typical Kirkendall effect, the impurity residues incorporated in electroplated Cu has been identified as an important factor to accelerate the void formation and to affect the interfacial reactions at the pure Sn and SnAgCu solder joints. In this study, the impurity effects on the void formation and interfacial reactions of the SnZn-based solder joints are investigated by performing the thermal analysis, microstructural observation, and kinetic assessments. The results show that compared to the Sn-3Ag-0.5Cu solder joint the impurity effect on the void formation at the SnZn-based solder joints is insignificant but peculiar phase transformation is observed. |
Proceedings Inclusion? |
Planned: |
Keywords |
Joining, Solidification, Thin Films and Interfaces |