| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXIII
|
| Presentation Title |
Microstructure and Strength of Sn-Ag-Cu Solder Joint Using Blue Diode Laser |
| Author(s) |
Hiroaki Tatsumi, Yuki Kida, Keisuke Takenaka, Seiji Kaneshita, Yuji Sato, Masahiro Tsukamoto, Hiroshi Nishikawa |
| On-Site Speaker (Planned) |
Hiroaki Tatsumi |
| Abstract Scope |
This research focuses on optimizing the efficiency of laser soldering in electronic packaging technology. Traditional infrared (IR) laser soldering often faces limitations due to the poor absorptivity of metals involved. Our study introduced a blue diode laser soldering system, revealing it to have a 43% higher heat efficiency than the IR diode laser for Sn-Ag-Cu solder soldering. Blue laser soldering allowed joint formation with less output power and irradiation time, while maintaining comparable joint impact strengths. Additionally, this study investigated the application of blue semiconductor laser soldering for pure copper. It exhibited enhancing processing efficiency and reducing soldering time for Cu joints. Overall, blue laser soldering proved to be a promising, energy-efficient approach for electronic packaging, offering substantial improvements over conventional soldering methods. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Joining, |