Conference Tools for 2024 TMS Annual Meeting & Exhibition
Login
Register as a New User
Help
Submit An Abstract
Propose A Symposium
Presenter/Author Tools
Organizer/Editor Tools
About this Abstract
Meeting
2024 TMS Annual Meeting & Exhibition
Symposium
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXIII
Presentation Title
Author(s)
On-Site Speaker (Planned)
Abstract Scope
Proceedings Inclusion?
Planned:
OTHER PAPERS PLANNED FOR THIS SYMPOSIUM
A-27: Co/Bi2(Se,Te)3 Interfacial Reactions and Bi-Co-Se-Te Phase Equilibria
A-28: Cu Surface Protection Treatments for Anti-oxidation and Anti-corrosion
A-29: Efficiency Enhancement of P-I-N Perovskite Solar Cells by Self-assembled Silane Treatment of Hole Transporting Layer
A-30: Electric Current-induced Unexpected Phase Transition for the ƞ'-Cu6Sn5 Phase at Low Temperatures
A-31: Impurity Effects on Interfacial Reactions between Sn-Zn-based Solders and Electroplated Cu Films
A-32: Silver Nanoparticles Modified Polyimide Covalent Organic Frameworks Composites for Dye-sensitized Solar Cells
A-33: Study on the Stability of the Synergistic Inhibition Effect of Metal Ions and Nitrides on Copper Corrosion
A Comprehensive Study of Microstructure, Texture, and Properties Evolutions in Pure Metals Induced by Electric Current Stressing
Active Metal Brazing for Fabricating Cu/Si3N4/Cu Substrates with Ag-Cu-Ti Pastes
Ag and Cu Whiskers in the Ag-Cu-Se Ternary System
Bonding Strength of ENIG Joint Using Micro-sized Ag Particles with Submicron Ceramic Particles
Effective Suppression of Boron Dopant on the Interfacial Reactions of Electroplating Co(B) Deposits and Lead-free Solders
Effects of Bi and In on the Growth of Intermetallic Compounds
Effects of Storage Time on the Growth of Cu(In,Sn)
2
Electric Current Effects on Stability and Mechanical Properties of Monoclinic Cu6Sn5 Phase Based on In-situ Nanoindentation
Electrochemically Based and Coupled Approaches for Tracking Phase Transformations in Energy Storage Materials
Evolution of Vibrational Modes during Antiferrodistortive Phase Transition in SrTiO
3
Exploration of Gel Hardness by Using Machine Learning Method
Growth Kinetics and Morphological Evolution of Compounds in Cu-eutectic Sn-Bi Alloy System with Ag and Ni
Improvement of Microelectronic Joint Reliability through the Optimization of IMC Nanomechanical Properties
Improving Mechanical Properties of Eutectic Sn-Zn Low-Melting Alloy by Indium Addition
In-situ Study of Phase Transformation and Strain Localization in Multi-phase Alloys
Interfacial Reaction in the Liquid/Solid Lead-free Solder/Cu-Ni-Si-Mg Alloy (C7025) Couples
Microstructure and Strength of Sn-Ag-Cu Solder Joint Using Blue Diode Laser
Phase Equilibrium of Cu-Sn-Ti Ternary System at 450 ℃
Phase Stability and Binodal/Spinodal Decomposition of Ag- and S-alloyed CIGS Absorbers: An Ab Initio-assisted CALPHAD Study with Key Experiments
Properties and Phase Transformations of Manganese Oxides for Environmentally Friendly Batteries
Superplasticity Deformation of Sn-Bi Based Solder Alloys
The Effect of Nitrogen on the Stability of the β Phase in W Thin Films during Thermal Annealing
The Effect of Nitrogen on Thermomechanical Behavior during the β-α Phase Transformation in W Thin Films
X-ray Diffraction on Solder-related Intermetallic Phases
Questions about ProgramMaster? Contact
programming@programmaster.org