About this Abstract |
Meeting |
2020 TMS Annual Meeting & Exhibition
|
Symposium
|
2020 Technical Division Student Poster Contest
|
Presentation Title |
SPG-16: Impact of Isothermal Aging on Single Solder Joint Shear: Cu Depletion Zone Effect |
Author(s) |
Naveen Daham Weerasekera, Ande Kitamura, Chelsea Morand, Tae-Kyu Lee |
On-Site Speaker (Planned) |
Naveen Daham Weerasekera |
Abstract Scope |
Single solder joint shear test are performed on isothermally aged Sn-1Ag-0.5Cu (wt%) solder joints. It is observed that an intermediate holding time at 150oC induced a Cu depletion zone near the solder to substrate interface. This Cu depletion is caused by the consumption of the Cu due to the growth of the interface intermetallic layer. With an optimized shear height, the single shear test was able to identify the shear strength of the Cu depleted region. A phase field modeling (PFM) of material (Cu) transport in Sn base solder interconnects subjected to isothermal aging was performed. Initial precipitate distribution of Cu similar to experimental distribution is evolved with time and final microstructure of the model with the experimental microstructure (SEM Micrographs) are compared.The shear region between the intermetallic and solder interface show a dynamic chemical gradient with the isothermal aging conditions, which reveal a specific degradation mechanism. |
Proceedings Inclusion? |
Undecided |