About this Abstract |
Meeting |
2020 TMS Annual Meeting & Exhibition
|
Symposium
|
2020 Technical Division Student Poster Contest
|
Presentation Title |
SPG-15: Impact of Cryogenic Temperature Cycling on Single Solder Joint Shear Stability |
Author(s) |
Ande Kitamura, Timothy Mathews, Ruben Contreras, Tae-Kyu Lee |
On-Site Speaker (Planned) |
Ande Kitamura |
Abstract Scope |
Recent application in quantum computing and extreme environment end-use conditions pushed the temperature limit for an electric component to an unprecedented low temperature. Although the performance of components at extreme temperatures are extensively studied, the interconnections that are mainly Sn need a thorough observation and assessment to support the mechanical and electrical stability at low temperature environments due to the abrupt changes in stress at the interconnection interface. Sn-Ag-Cu solder balls are shear tested after -196oC to room temperature thermal cycling. The cryogenic temperature thermal cycling revealed microcrack developments at the intermetallic interface region, which are detected by the shear strength reduction during single joint shear test performed at various temperature conditions. Isothermal aging condition prior to the cryogenic cycling indicated a further degradation in certain aging conditions. The correlation between the cryogenic cycling and the degradation mechanism will be discussed along with the microstructure evolution during cryogenic temperature cycling. |
Proceedings Inclusion? |
Undecided |