|About this Abstract
||2nd International Conference on Technological Innovations in Metals Engineering (TIME)
||Technological Innovations in Metals Engineering (TIME)
||Binder Jetting 3D Printing of Magnetron Sputtering Metallic Targets
||Christopher Y. Bansah, Brett Conner, C. Virgil Solomon
|On-Site Speaker (Planned)
||Christopher Y. Bansah
Metallic films applied in semiconductor devices are made from sputtering of metallic targets. The rising need to reduce cost of target, target consumption efficiency and improving thin film properties are of great interest. This study was aimed at investigating the potential application of additive manufacturing for producing metallic targets such as copper, 316L stainless steel, and Ni-Mn-Ga. The metallic targets were prepared using powders obtained by ball milling and gas atomization. Morphological and size distribution studies were performed on the powders to help select the printing parameters. The chemical composition and the crystal structure of powders were also determined. Once printed, targets are cured and sintered for densification under argon atmosphere. The crystal structure, chemical composition and microstructure were investigated using XRD, EDS, and SEM. Thin films produced using printed targets in a direct current magnetron sputtering system revealed the practicability of using additive manufacturing to produce metallic sputtering targets.