About this Abstract |
Meeting |
2024 TMS Annual Meeting & Exhibition
|
Symposium
|
Defects and Interfaces: Modeling and Experiments
|
Presentation Title |
Solubility and Short Circuit Diffusion of BCC Transition Metals in Cu Grain Boundaries |
Author(s) |
E Sheu, TY Liu, JK Baldwin, DJ Williams, Michael J. Demkowicz |
On-Site Speaker (Planned) |
Michael J. Demkowicz |
Abstract Scope |
The equilibrium solubility of BCC transition metals in copper (Cu) is miniscule. We present experimental evidence that certain grain boundaries (GBs) in Cu nevertheless exhibit significant solubility and, consequently, permeability of niobium (Nb) and vanadium (V), yet no solubility or permeability of molybdenum (Mo). We synthesize tri-layer samples consisting of a Cu layer deposited between two unlike BCC metals: Nb, V, or Mo. After a brief, high-temperature anneal, we observe one of the BCC metals permeating through certain GBs in the Cu layer. Atomistic modeling of these GBs shows that they possess significant solubility for the permeating BCC element. We discuss the consequences of these findings for the thermal stability of BCC/Cu nanocomposites. |
Proceedings Inclusion? |
Planned: |
Keywords |
Modeling and Simulation, Thin Films and Interfaces, Characterization |