About this Abstract |
Meeting |
MS&T22: Materials Science & Technology
|
Symposium
|
Manufacturing and Processing of Advanced Ceramic Materials
|
Presentation Title |
Impact of Embossing Geometry on the Replication Accuracy of Microchannels in Tape Cast Ceramics |
Author(s) |
Harrison Teutschbein, Mingwei Xu, Yue Qiu, Chirag R Kharangate, James C McGuffin-Cawley, Jennifer LW Carter |
On-Site Speaker (Planned) |
Jennifer LW Carter |
Abstract Scope |
The advancement of high-powered electronics requires new thermal-management systems. Active cooling using microfluidics within ceramic substrates can increase device performance over passive radiative fins - if issues surrounding manufacturability can be solved. One approach is to emboss and laminate high thermal-conductivity ceramic tapes to create the necessary embedded micro-scale channels. In this work, we attempt to understand the relationship between load and displacement acquired during embossing to the resulting feature dimensions. Embossing tools with rectangular channels of various channel/wall size ratios (3:1, 1:1, and 1:3) were created to understand how silicon nitride and alumina tapes behave under different constraints. The microchannel and wall features were measured using optical profilometry after embossing, and again after sintering; preliminary results indicate that sintering shrinkage depends on the geometric constraint. These results were used to more efficiently design tooling and loading conditions to meet device design requirements. |