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Meeting 2024 TMS Annual Meeting & Exhibition
Symposium Bio-Nano Interfaces and Engineering Applications
Presentation Title Quantifying Surface Topographies on Antimicrobial Copper
Author(s) Terry C. Lowe, Daniela P Hirsch, Beatrice L Lowe, Scott C Dahl, Clinton L Hawkins, Naveen S Kailas, Máté Szűcs, Laszlo S Toth
On-Site Speaker (Planned) Terry C. Lowe
Abstract Scope Specific angular topographies on metal surfaces can create non-uniform charge distributions that can disrupt biochemical processes and structures of nearby microbes. A new method has been developed to assess the density and asperity of topographical features designed to neutralize viral and bacterial pathogens. Coarse grain and ultrafine grain high-purity copper surfaces were chemically treated to impart microscale and nanoscale architectures. Images from Scanning Electron Microscopy and topographical data from Atomic Force Microscopy were analyzed using algorithms to quantify the electrostatic potential of the surfaces. We found that treated surfaces of coarse grain copper produced by conventional rolling and annealing, and ultrafine grained copper made using a new High Shear Deformation process, Friction-Assisted Lateral Extrusion Process both resulted in average asperity spacings smaller than the size of pathogens. However, the ultrafine grain copper had a Surface Asperity Charge Density that was 4.5 times greater than the coarse grain copper. Means to further enhance the computation of a quantitative measure of Surface Asperity Charge Density were identified. The analysis algorithms provide the basis for developing machine learning methods to optimize the antimicrobial effectiveness of copper surfaces.
Proceedings Inclusion? Planned:
Keywords Biomaterials, Computational Materials Science & Engineering, Nanotechnology


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