| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Spatially Tailored Materials: Processing-Structure-Properties
|
| Presentation Title |
Dynamic Tensile Damage and Spall Behavior of Electroplated Nickel |
| Author(s) |
Gary Simpson, Esther Hessong, Saryu Fensin |
| On-Site Speaker (Planned) |
Gary Simpson |
| Abstract Scope |
The susceptibility of metals to high-rate tensile damage is often quantified by the magnitude of tensile stress necessary to nucleate, grow, and subsequently coalesce microscale failure features—typically voids in ductile metals—into macroscale cracks. This stress or spall strength is typically measured via plate impact experiments. Here we investigate the spall strength and damage morphology of both wrought and electroplated nickel via surface velocimetry and post-mortem metallography of recovered samples. The spall strength of the electroplated nickel, as estimated by free-surface pullback velocity, is nearly twice that of the wrought material, exceeding 3.5 GPa. In this work, we explore the microstructural effects of highly directional grain refinement—in the form of a columnar grain structure—on spall damage in the electroplated metal which in comparison to the wrought standard greatly reduces the effective grain size transverse to the shock but not in the direction of loading. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Mechanical Properties, Characterization, Copper / Nickel / Cobalt |