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Meeting 2024 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXIII
Sponsorship
Organizer(s) Yu-chen Liu, National Cheng Kung University
Hiroshi Nishikawa, Osaka University
Shih-kang Lin, National Cheng Kung University
Chao-hong Wang, National Chung Chung University
Chih-Ming Chen, National Chung Hsing University
Jaeho Lee, Hongik University
Zhi-Quan Liu, Shenzhen Institutes of Advanced Technology
Ming-Tzer Lin, National Chung Hsing University
Yee-wen Yen, National Taiwan University of Science and Technology
A.S.Md Abdul Haseeb, Bangladesh University of Engineering and Technology (BUET)
Ligang Zhang, Central South University
Sehoon Yoo, KITECH
Ping-Chuan Wang, SUNY New Paltz
Yu-An Shen, Feng Chia University
Scope This is the 23nd in a series of TMS symposia addressing the stability, transformation, and formation of phases during the fabrication, processing, and utilization of electronic materials and devices. Topics of interests range from microelectronic technologies to advanced energy technologies, including phase stability, transformation, formation, and morphological evolution of electronic packaging materials, interconnection materials, integrated circuit materials, optoelectronic materials as well as energy storage and generating materials.
Abstracts Due 07/01/2023
Proceedings Plan Undecided
PRESENTATIONS APPROVED FOR THIS SYMPOSIUM INCLUDE
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