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Meeting 2024 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXIII
Presentation Title The Effect of Nitrogen on Thermomechanical Behavior during the β-α Phase Transformation in W Thin Films
Author(s) Yue Zhao, Hannah Elizabeth Morgan-Smith Myers, Shefford P. Baker
On-Site Speaker (Planned) Shefford P. Baker
Abstract Scope The β phase (A15) in tungsten thin films is metastable and irreversibly transforms to the stable α phase (BCC) upon thermal annealing. β-W has unique properties including a giant spin Hall effect which is of great interest for use in spintronic memory devices. For such applications, the stability of the β phase during processing and use must be understood. We sputtered W films with different nitrogen contents onto Si substrates and measured curvature to determine stress as a function of temperature during cycles up to 900℃ in vacuum. A difference in density leads to large (~GPa) increases in tensile stress during the β to α phase transformation, making this a sensitive in-situ probe of that transformation. Increasing nitrogen concentration inhibits the phase transformation, resulting in higher initiation and completion temperatures, and leads to larger stress changes. Additional stress changes were correlated with microstructure changes characterized using XRD, SEM and EBSD.
Proceedings Inclusion? Planned:
Keywords Thin Films and Interfaces, Phase Transformations, Other

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

A-27: Co/Bi2(Se,Te)3 Interfacial Reactions and Bi-Co-Se-Te Phase Equilibria
A-28: Cu Surface Protection Treatments for Anti-oxidation and Anti-corrosion
A-29: Efficiency Enhancement of P-I-N Perovskite Solar Cells by Self-assembled Silane Treatment of Hole Transporting Layer
A-30: Electric Current-induced Unexpected Phase Transition for the ƞ'-Cu6Sn5 Phase at Low Temperatures
A-31: Impurity Effects on Interfacial Reactions between Sn-Zn-based Solders and Electroplated Cu Films
A-32: Silver Nanoparticles Modified Polyimide Covalent Organic Frameworks Composites for Dye-sensitized Solar Cells
A-33: Study on the Stability of the Synergistic Inhibition Effect of Metal Ions and Nitrides on Copper Corrosion
A Comprehensive Study of Microstructure, Texture, and Properties Evolutions in Pure Metals Induced by Electric Current Stressing
Active Metal Brazing for Fabricating Cu/Si3N4/Cu Substrates with Ag-Cu-Ti Pastes
Ag and Cu Whiskers in the Ag-Cu-Se Ternary System
Bonding Strength of ENIG Joint Using Micro-sized Ag Particles with Submicron Ceramic Particles
Effective Suppression of Boron Dopant on the Interfacial Reactions of Electroplating Co(B) Deposits and Lead-free Solders
Effects of Bi and In on the Growth of Intermetallic Compounds
Effects of Storage Time on the Growth of Cu(In,Sn)2
Electric Current Effects on Stability and Mechanical Properties of Monoclinic Cu6Sn5 Phase Based on In-situ Nanoindentation
Electrochemically Based and Coupled Approaches for Tracking Phase Transformations in Energy Storage Materials
Evolution of Vibrational Modes during Antiferrodistortive Phase Transition in SrTiO3
Exploration of Gel Hardness by Using Machine Learning Method
Growth Kinetics and Morphological Evolution of Compounds in Cu-eutectic Sn-Bi Alloy System with Ag and Ni
Improvement of Microelectronic Joint Reliability through the Optimization of IMC Nanomechanical Properties
Improving Mechanical Properties of Eutectic Sn-Zn Low-Melting Alloy by Indium Addition
In-situ Study of Phase Transformation and Strain Localization in Multi-phase Alloys
Interfacial Reaction in the Liquid/Solid Lead-free Solder/Cu-Ni-Si-Mg Alloy (C7025) Couples
Microstructure and Strength of Sn-Ag-Cu Solder Joint Using Blue Diode Laser
Phase Equilibrium of Cu-Sn-Ti Ternary System at 450 ℃
Phase Stability and Binodal/Spinodal Decomposition of Ag- and S-alloyed CIGS Absorbers: An Ab Initio-assisted CALPHAD Study with Key Experiments
Properties and Phase Transformations of Manganese Oxides for Environmentally Friendly Batteries
Superplasticity Deformation of Sn-Bi Based Solder Alloys
The Effect of Nitrogen on the Stability of the β Phase in W Thin Films during Thermal Annealing
The Effect of Nitrogen on Thermomechanical Behavior during the β-α Phase Transformation in W Thin Films
X-ray Diffraction on Solder-related Intermetallic Phases

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