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Meeting 2024 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXIII
Presentation Title Growth Kinetics and Morphological Evolution of Compounds in Cu-eutectic Sn-Bi Alloy System with Ag and Ni
Author(s) Minho O, Yuki Tanaka, Equo Kobayashi
On-Site Speaker (Planned) Minho O
Abstract Scope This study investigated the growth kinetics and rate-controlling processes of intermetallic layers between Cu and Sn-58wt.% Bi alloys with Ag and Ni. The diffusion couples were isothermally annealed at the solid-state temperatures for various times up to 384 h. The intermetallic layer consists of irregularly scalloped Cu6Sn5 and uniformly thin Cu3Sn formed at the interface. Isothermal sections of the ternary Bi-Cu-Sn system were calculated using a CALPHAD method, revealing the diffusion path passing through the Cu6Sn5 and Cu3Sn phases. The layer growth was controlled by boundary diffusion, with grain growth as the dominant growth mechanism based on the experimental observation. The morphological evolution of the intermetallic compound and the widening of the Sn-Bi eutectic microstructure were observed. Furthermore, the activation enthalpy for the layer growth by boundary diffusion with grain growth was determined, providing insights into the energy barrier for atomic diffusion across the interface.
Proceedings Inclusion? Planned:
Keywords Joining, Electrometallurgy, Phase Transformations

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

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A-33: Study on the Stability of the Synergistic Inhibition Effect of Metal Ions and Nitrides on Copper Corrosion
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Effects of Storage Time on the Growth of Cu(In,Sn)2
Electric Current Effects on Stability and Mechanical Properties of Monoclinic Cu6Sn5 Phase Based on In-situ Nanoindentation
Electrochemically Based and Coupled Approaches for Tracking Phase Transformations in Energy Storage Materials
Evolution of Vibrational Modes during Antiferrodistortive Phase Transition in SrTiO3
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Growth Kinetics and Morphological Evolution of Compounds in Cu-eutectic Sn-Bi Alloy System with Ag and Ni
Improvement of Microelectronic Joint Reliability through the Optimization of IMC Nanomechanical Properties
Improving Mechanical Properties of Eutectic Sn-Zn Low-Melting Alloy by Indium Addition
In-situ Study of Phase Transformation and Strain Localization in Multi-phase Alloys
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Microstructure and Strength of Sn-Ag-Cu Solder Joint Using Blue Diode Laser
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Phase Stability and Binodal/Spinodal Decomposition of Ag- and S-alloyed CIGS Absorbers: An Ab Initio-assisted CALPHAD Study with Key Experiments
Properties and Phase Transformations of Manganese Oxides for Environmentally Friendly Batteries
Superplasticity Deformation of Sn-Bi Based Solder Alloys
The Effect of Nitrogen on the Stability of the β Phase in W Thin Films during Thermal Annealing
The Effect of Nitrogen on Thermomechanical Behavior during the β-α Phase Transformation in W Thin Films
X-ray Diffraction on Solder-related Intermetallic Phases

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