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Meeting 2024 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXIII
Presentation Title A-33: Study on the Stability of the Synergistic Inhibition Effect of Metal Ions and Nitrides on Copper Corrosion
Author(s) Po-Cheng Chou, Tsung-Hao Yang, Chih-Ming Chen
On-Site Speaker (Planned) Po-Cheng Chou
Abstract Scope Recently, numerous studies have focused on the synergistic effects of metal cations and organic compounds in the inhibition of metal corrosion. However, the metal cations might be potentially reduced during storage, leading to a decline in the inhibition efficiency and a shortened lifetime. To realize the stability issue, the composite inhibitors are added in a corrosive medium and electrochemical analysis is performed over a period of several days to observe the changes of inhibition efficiency toward the metal corrosion. The results show a decrease in inhibition efficiency from an initial value of 50% to 21%, confirming poor long-term stability of composite inhibitors. To study this stability issue, the coordination of various nitrogen-containing compounds with metal cations is investigated to compare their inhibitory effects and service lifetime. In addition, mechanical dynamics simulation, SEM, and XPS techniques are used to explore the inhibition mechanism of composite inhibitors in the metal corrosion.
Proceedings Inclusion? Planned:
Keywords Electronic Materials, Copper / Nickel / Cobalt, Characterization

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

A-27: Co/Bi2(Se,Te)3 Interfacial Reactions and Bi-Co-Se-Te Phase Equilibria
A-28: Cu Surface Protection Treatments for Anti-oxidation and Anti-corrosion
A-29: Efficiency Enhancement of P-I-N Perovskite Solar Cells by Self-assembled Silane Treatment of Hole Transporting Layer
A-30: Electric Current-induced Unexpected Phase Transition for the ƞ'-Cu6Sn5 Phase at Low Temperatures
A-31: Impurity Effects on Interfacial Reactions between Sn-Zn-based Solders and Electroplated Cu Films
A-32: Silver Nanoparticles Modified Polyimide Covalent Organic Frameworks Composites for Dye-sensitized Solar Cells
A-33: Study on the Stability of the Synergistic Inhibition Effect of Metal Ions and Nitrides on Copper Corrosion
A Comprehensive Study of Microstructure, Texture, and Properties Evolutions in Pure Metals Induced by Electric Current Stressing
Active Metal Brazing for Fabricating Cu/Si3N4/Cu Substrates with Ag-Cu-Ti Pastes
Ag and Cu Whiskers in the Ag-Cu-Se Ternary System
Bonding Strength of ENIG Joint Using Micro-sized Ag Particles with Submicron Ceramic Particles
Effective Suppression of Boron Dopant on the Interfacial Reactions of Electroplating Co(B) Deposits and Lead-free Solders
Effects of Bi and In on the Growth of Intermetallic Compounds
Effects of Storage Time on the Growth of Cu(In,Sn)2
Electric Current Effects on Stability and Mechanical Properties of Monoclinic Cu6Sn5 Phase Based on In-situ Nanoindentation
Electrochemically Based and Coupled Approaches for Tracking Phase Transformations in Energy Storage Materials
Evolution of Vibrational Modes during Antiferrodistortive Phase Transition in SrTiO3
Exploration of Gel Hardness by Using Machine Learning Method
Growth Kinetics and Morphological Evolution of Compounds in Cu-eutectic Sn-Bi Alloy System with Ag and Ni
Improvement of Microelectronic Joint Reliability through the Optimization of IMC Nanomechanical Properties
Improving Mechanical Properties of Eutectic Sn-Zn Low-Melting Alloy by Indium Addition
In-situ Study of Phase Transformation and Strain Localization in Multi-phase Alloys
Interfacial Reaction in the Liquid/Solid Lead-free Solder/Cu-Ni-Si-Mg Alloy (C7025) Couples
Microstructure and Strength of Sn-Ag-Cu Solder Joint Using Blue Diode Laser
Phase Equilibrium of Cu-Sn-Ti Ternary System at 450 ℃
Phase Stability and Binodal/Spinodal Decomposition of Ag- and S-alloyed CIGS Absorbers: An Ab Initio-assisted CALPHAD Study with Key Experiments
Properties and Phase Transformations of Manganese Oxides for Environmentally Friendly Batteries
Superplasticity Deformation of Sn-Bi Based Solder Alloys
The Effect of Nitrogen on the Stability of the β Phase in W Thin Films during Thermal Annealing
The Effect of Nitrogen on Thermomechanical Behavior during the β-α Phase Transformation in W Thin Films
X-ray Diffraction on Solder-related Intermetallic Phases

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