ProgramMaster Logo
Conference Tools for 5th International Congress on 3D Materials Science (3DMS 2020)
Login
Register as a New User
Help
Submit An Abstract
Propose A Symposium
Presenter/Author Tools
Organizer/Editor Tools
About this Symposium
Meeting 5th International Congress on 3D Materials Science (3DMS 2020)
Symposium 5th International Congress on 3D Materials Science (3DMS 2020)
Organizer(s) Dorte Juul Jensen, Technical University of Denmark
Erica Thea Lilleodden, Helmholtz-Zentrum Geesthacht
Scott A. Barnett, Northwestern University
Keith E. Knipling, Naval Research Laboratory
Matthew P. Miller, Cornell University
Akira Taniyama, Nippon Steel Corporation
Hiroyuki Toda, Kyushu University
Lei Zhang, Chinese Academy of Sciences
Scope The 5th International Congress on 3D Materials Science seeks to provide the premier forum for presentations of current interest and significance to the three-dimensional characterization, visualization, quantitative analysis, modeling, and development of structure–property relationships of materials, as well as big data and machine learning issues associated with 3D materials science. Additionally, this congress will provide an intimate environment for rich discussions and interactions among the key researchers in the world to not only assess the state-of-the-art within the various elements of 3D materials science, but also to roadmap the key areas of future research.
Abstracts Due 11/24/2019
Proceedings Plan Undecided
IF YOU WOULD LIKE TO SUBMIT AN ABSTRACT . . .
. . . you are welcome to do so. Just click on the button. Note: To submit an abstract, you must be registered and logged into the system.

Questions about ProgramMaster? Contact programming@programmaster.org