Additive Manufacturing of Silicon Nitride Using a Slurry Approach
Beth L. Armstrong1*, Corson L. Cramer2, Benjamin Lamm1, Trevor Aguirre2, and David J. Mitchell1
1. Materials Science and Technology Division, Oak Ridge National Laboratory, Oak Ridge, TN
2. Manufacturing Science Division, Oak Ridge National Laboratory, Oak Ridge, TN
Additive Manufacturing (AM) of silicon nitride using nonaqueous or aqueous slurry approaches continues to draw interest for the fabrication of complex shaped ceramic components for high temperature applications. The variables that impact the processability of slurry-based AM are similar to those of traditional ceramic processing techniques. Powder characteristics, such as particle size, surface area, and morphology, and their effect on the powder-solvent interface will be explored as it relates to zeta potential, rheological behavior, and ultimately, “printability” and sintered density. Examples utilizing lithography and extrusion-type slurry printing will be presented.
This manuscript has been authored by UT-Battelle, LLC under Contract No. DE-AC05-00OR22725 with the U.S. Department of Energy.