About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
|
Deformation Mechanisms, Microstructure Evolution, and Mechanical Properties of Nanoscale Materials
|
Presentation Title |
An Experimental and Modeling Investigation of Creep Resistance of a Stable Nanocrystalline Alloy |
Author(s) |
C Kale, R Koju, B Hornbuckle, K Darling, Y Mishan, Kiran Solanki |
On-Site Speaker (Planned) |
Kiran Solanki |
Abstract Scope |
Nanocrystalline (NC) materials possess excellent room temperature properties, such as high-strength, and toughness as compared to their coarse-grained counterparts. However, NC microstructures are unstable at higher temperatures. Significant grain growth is observed already at moderately low-temperatures, limiting broader applicability of NC-materials. Here, we present a design approach that leads to a significant improvement in the high temperature creep resistance (up to 0.64 of the melting temperature) of a NC Cu-Ta alloy. The design approach involves alloying of pure elements to create a distribution of nanometer sized solute clusters within the grains and along the grain boundaries. We demonstrate that the addition of Ta nanoclusters inhibits the migration of grain boundaries at high temperatures and reduces the dislocation motion. This leads to a highly unusual creep behavior. This design strategy can be readily scaled-up for bulk manufacturing of creep-resistant NC parts and transferred to other multicomponent systems such as Ni-based alloys. |
Proceedings Inclusion? |
Planned: |
Keywords |
Nanotechnology, Mechanical Properties, Other |