About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
|
Deformation Mechanisms, Microstructure Evolution, and Mechanical Properties of Nanoscale Materials
|
Presentation Title |
G-18: Structures and Nanomechanical Behavior of Cu-Mo-W Nanocomposite Thin Films |
Author(s) |
Forrest Wissuchek, Bibhu P. Sahu, Amit Misra |
On-Site Speaker (Planned) |
Forrest Wissuchek |
Abstract Scope |
The morphology of multiphase thin films produced by co-depositing immiscible elements is dependent on the competition between how fast the species diffuse on the surface and how quickly they are buried by the incoming deposition. The processing-structure relationship of binary systems, such as Cu-Mo, has identified morphological transitions due to increasing the processing temperature or decreasing the deposition rate. Adding W, a bcc refractory metal with very low mobility, impedes phase separation and delays the morphological transitions seen previously in Cu-Mo to higher deposition temperatures. The Cu-Mo-W nanocomposites deposited at temperatures above 800 C display a very fine layered structure which is unique at such elevated temperatures. The fine layered structure exhibits high strength due to the high density of interfaces, and compared to sequentially deposited multilayers with similar layer thicknesses, exhibit enhanced ductility by preventing shear banding. |
Proceedings Inclusion? |
Planned: |
Keywords |
Characterization, Mechanical Properties, Thin Films and Interfaces |