About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
|
Deformation Mechanisms, Microstructure Evolution, and Mechanical Properties of Nanoscale Materials
|
Presentation Title |
Inter-relationship of Stress and Microstructure in BCC and ‘Beta’ Tungsten Films |
Author(s) |
Jonathan 'Drew' Johnson, Tong Su, Eric Chason, Gregory B. Thompson |
On-Site Speaker (Planned) |
Gregory B. Thompson |
Abstract Scope |
Thin films experience significant residual stresses during deposition that is linked to the coalescence of the film. A series of W films are deposited at different deposition rates and pressures. Films deposited at the three highest pressures were tensile in stress, had small grains (~ 15 to 20 nm), and stabilized the metastable A15 phase often referred to as beta-W. At the lowest pressure, the films were compressive in stress, larger grain sizes (~ 70 to 90 nm), and primarily stabilized the bcc W phase. If a W seed layer was grown under either the bcc W or beta-W growth conditions, the subsequent W layer adopted the phase state of the seed layer, independent of processing conditions and/or grain sizes, suggesting that the phase state is most likely determined in the initial stages of nucleation. |
Proceedings Inclusion? |
Planned: |
Keywords |
Characterization, Thin Films and Interfaces, Phase Transformations |