About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
|
Materials Research in Reduced Gravity
|
Presentation Title |
Structure and Properties of the Solder Joints Produced in Terrestrial and Microgravity Environment |
Author(s) |
Manish Kumar, Sid Pathak |
On-Site Speaker (Planned) |
Manish Kumar |
Abstract Scope |
Using Lead-Tin (40wt%Pb-60wt%Sn) solders from the In-Space Soldering Investigation, along with freshly made terrestrial solders of the same composition, we demonstrate how the lack of Earth’s natural convective flow and buoyancy effects during melting/solidification onboard the International Space Station affects its microstructure and properties. Our scanning electron microscopy and Micro-computed tomography analysis demonstrate a considerable amount of internal porosity (about four times that of terrestrial solder) in the microgravity solder. We also performed a detailed analysis of the substantial effect of aging on the ISSI solder microstructure and properties over the past 17 years.
Additionally, we report on the micro-mechanical behavior of the solder joints under extreme conditions of cryogenic temperatures similar to those typically experienced by the ISS (-150oC on shady side outside the ISS). These tests examine the effects of β-to-α phase transformation in Sn below 13oC and the associated volume and internal stress changes in Pb-Sn solders. |
Proceedings Inclusion? |
Planned: |
Keywords |
Solidification, Characterization, Phase Transformations |