| About this Abstract |
| Meeting |
2022 TMS Annual Meeting & Exhibition
|
| Symposium
|
2022 Technical Division Student Poster Contest
|
| Presentation Title |
SPU-5: Thermomechanical Clamp for Curing Low-κ Dielectric Dry Films |
| Author(s) |
Ethan Shackelford, Pragna Bhaskar, Mohanalingam Kathaperumal, Madhavan Swaminathan |
| On-Site Speaker (Planned) |
Ethan Shackelford |
| Abstract Scope |
Dry film technology is commonly used for deposition of dielectrics, photoresists, passivation layers, and other polymer films. These dry films are often deposited onto the substrate in two steps, lamination and curing, both requiring varying temperatures, atmospheres, and pressures to achieve adhesion. While vacuum laminators and controlled atmosphere ovens are commercially available for curing under pressure, there are few lab-scale solutions. A new design is proposed to allow for curing these dry films at high temperatures and pressures.
A mechanical clamp is designed to cure a low-κ polymer dielectric dry film to improve adhesion to the substrate. The device utilizes different coefficients of thermal expansion and moduli of materials to apply increasing pressure at increased temperatures. Varying thicknesses of material components and pretension of bolt members were modelled and simulated using SOLIDWORKS. The results discussing temperature and pressure distributions across the wafer will be compared for different parameters. |
| Proceedings Inclusion? |
Undecided |
| Keywords |
Modeling and Simulation, Thin Films and Interfaces, Mechanical Properties |