|About this Abstract
||MS&T22: Materials Science & Technology
||Controlled Synthesis, Processing, and Applications of Structural and Functional Nanomaterials
||Enhancing the Low-temperature Consolidation of Nanosilver Materials
||Henry D. Young, Jared McCoppin
|On-Site Speaker (Planned)
||Henry D. Young
Nanosilver materials represent a potential alternative to polymer-filled epoxies in high-temperature electronics die attach applications. Silver nanoparticles, with diameters typically in the 10-30nm range, can be consolidated to solid silver structures at temperatures significantly under the bulk sintering temperature range, at low pressure and temperatures. Surface diffusion acts as the primary sintering/consolidation mechanism, and sufficient mass transport can occur to allow nanoparticle consolidation at pressure in the 1-10 MPa range and at 100-300C. Such “cold sintering” processes allow die attach with a controlled zero-stress point, which has significant advantages in power electronics packages. We have studied the effect of a range of nanosilver sintering aids, such as AgNO3 and other additives that can provide enhanced diffusion during consolidation, and their effect on microstructural development during consolidation.