Copper nanowire arrays exhibit attractive electrical, thermal, and mechanical properties with potential applications in many engineering fields such as thermal interface and electrical contacts. The reliability of Cu nanowire array-based devices relies on robust bonding between the nanowires and the substrates. Therefore, it is of great significance to evaluate and improve the bonding strength of Cu nanowire on the substrate. In this work, Cu nanowire arrays were prepared by electrochemical deposition on Cu substrate using polymer membrane templates. The mechanical properties of the nano arrays, including the elastic modulus, were characterized by nanoindentation method. The bonding strength between the nanowire array and the substrate was examined by nanoscratch technique. In addition, the electrical, thermal, and anti-corrosion behavior were studied. Furthermore, polydopamine (PDA) coating was applied on the Cu nanowire arrays, and the effect of the coating on the abovementioned properties were studied and compared to the bare Cu material.