About this Abstract |
Meeting |
2024 TMS Annual Meeting & Exhibition
|
Symposium
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Chemistry and Physics of Interfaces
|
Presentation Title |
Shear-punch Testing and Microstructural Evolution of Pure Cu and CuCr Alloys |
Author(s) |
Julian Escobar, Joshua Silverstein, Mert Efe, Lei Li, Shuang Li, Farhan Ishrak, Anqi Yu, Suveen Mathaudhu, Arun Devaraj, Bharat Gwalani |
On-Site Speaker (Planned) |
Julian Escobar |
Abstract Scope |
Shear deformation is crucial in solid-phase processing techniques to achieve grain refinement at submicrometric/nanometric scales. Establishing a connection between microstructure and mechanical properties during shear deformation poses unique challenges and requires refined experimental approaches. In this work, shear-punch testing is used to evaluate material behavior under shear loading on small volumes of pure Cu and a binary Cu-50 at.% Cr alloy. Electron backscatter diffraction and transmission electron microscopy were used to provide insights into the deformation mechanisms and investigate the microstructural evolution after plastic yield and before failure. Shear deformed microstructures in pure Cu consisted of a high density of microshear bands and geometrically necessary dislocations, as well as degraded twin boundaries. Preferential deformation of the softer Cu matrix (relative to the harder Cr phase) in the Cu-50 at.% Cr alloy led to shear-induced formation of low and high angle grain boundaries, and subsequent nanometric refinement. |
Proceedings Inclusion? |
Planned: |