About this Abstract |
Meeting |
MS&T22: Materials Science & Technology
|
Symposium
|
Grain Boundaries, Interfaces, and Surfaces: Fundamental Structure-Property-Performance Relationships
|
Presentation Title |
Effects of Interdiffusion on Cu/Ni Semi-coherent Interface Properties |
Author(s) |
Alex Selimov, Kevin Chu, David McDowell |
On-Site Speaker (Planned) |
Alex Selimov |
Abstract Scope |
Nanolaminate materials exhibit improved properties relative to their constituent materials due to a high density of interfaces. Accurate representation of interface structure is critical for accurately predicting nanolaminate properties and response to loading. Existing computational models generally assume atomically sharp interfaces and neglect the reality of interdiffusion which occurs as a result of manufacturing processes. The effects of intermixing of chemical species on the interface structure and properties must be characterized for improved predictions of real-world nanolaminate properties. This work will investigate the effects of increasing solute concentration and decreasing misfit dislocation density, as a result of interdiffusion, on the Cu/Ni system using atomistic simulation techniques. Interface energetics and distribution of solutes at the interface will be presented alongside the material response to tensile and shear loading. This work will show the range of material response obtained from diffuse interfaces, highlighting the importance of considering interdiffusion in reduced-order models. |