About this Abstract |
Meeting |
MS&T22: Materials Science & Technology
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Symposium
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Grain Boundaries, Interfaces, and Surfaces: Fundamental Structure-Property-Performance Relationships
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Presentation Title |
E-7: Molecular Dynamics Study of the Deformation Behavior of Metallic Substrates under Shear/Vibration |
Author(s) |
Milad Khajehvand, Henri Seppänen, Panthea Sepehrband |
On-Site Speaker (Planned) |
Milad Khajehvand |
Abstract Scope |
Ultrasonic bonding (UB) encompasses a large subset of joining techniques that are used in microelectronics packaging, additive manufacturing, and battery welding. In UB, ultrasonic vibration is applied parallel to the interface of two metallic parts to form a bond between them. This research work aims to use molecular dynamics simulations and understand the atomic-scale nature of this process. For this purpose, contact is formed between two metallic substrates through a nanoscale phenomenon known as jump-to-contact (JC) and then, the deformation behavior of the system and the evolution of dislocations are analyzed when the interface is under shear/vibration. The effect of various parameters including the crystallographic orientation of substrates, the twist misorientation between them, and the initial interfacial gap size before the occurrence of JC is studied in this work. While (111)-oriented substrates are found to exhibit grain boundary sliding, the (001)- and (110)-oriented systems present multiplication of interfacial dislocations. |