About this Abstract |
Meeting |
MS&T22: Materials Science & Technology
|
Symposium
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Grain Boundaries, Interfaces, and Surfaces: Fundamental Structure-Property-Performance Relationships
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Presentation Title |
E-2: Effect of Interfacial Microstructure on Tensile Property and Fracture Behaviour of Bicrystal and Polycrystal Fe/Ni Interface |
Author(s) |
Sien Liu, Shoichi Nambu |
On-Site Speaker (Planned) |
Sien Liu |
Abstract Scope |
The control of interfacial toughness is important in layered structure, where bicrystal and polycrystal interfaces have different deformation behaviour. Previous studies reported the presence of grains in interfacial region, but in-depth understanding on those grain boundaries (GBs) has been restricted by the grain size limitation of experimental method. In this study, we fabricated micro-size Fe/Ni bicrystal and polycrystal interfaces by solid state compressive bonding method to investigate the effects of grains in interfacial region on interfacial property and fracture behaviour. The results of micro-size uniaxial tensile test revealed that bicrystal interfaces show relatively higher bonding strength. In polycrystal interfaces, the lower energy release rate hinders instant fracture behaviour and hence, leads to enhanced interfacial toughness. Moreover, interfacial cracks were firstly observed at interface-GB junctions during tensile test, instead of high-stress-distributed notch spots. It is inferred that such junctions become weak spots and are attribute to the lower strength of polycrystal interfaces. |