| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advances in the State-of-the-Art of High Temperature Alloys
|
| Presentation Title |
Improving Creep Resistance of θ′-strengthened Al-Cu Alloys Through Grain-boundary Strengthening |
| Author(s) |
Jovid Rakhmonov, Sumit Bahl, David C. Dunand, Amit Shyam |
| On-Site Speaker (Planned) |
Jovid Rakhmonov |
| Abstract Scope |
Designing creep-resistant Al alloys expands their application scope in automotive and aerospace fields due to their lightweighting advantages. Recent studies have shown that the possibility of increasing the stability of θ′-Al2Cu precipitates to higher temperatures through interfacial segregation of Mn and Zr in cast Al-Cu based alloys provides high creep resistance up to 350 °C. High aspect ratio of platelet-shaped θ′-precipitates allows to effectively suppress dislocation climb mechanism, and therefore, dislocation creep in the grain interiors remains limited up to Orowan stress of the alloy. However, when grain cores/interiors are strong/creep-resistant, grain-boundary microstructure comes into play in determining alloy creep resistance. In this talk, we discuss the findings of our research efforts on (ⅰ) understanding of how grain-boundary microstructure has substantial influence on alloy creep resistance and (ⅱ) engineering new grain-boundary microstructures that provide high creep resistance to the alloy. |
| Proceedings Inclusion? |
Planned: |