| About this Abstract |
| Meeting |
2024 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2024)
|
| Symposium
|
2024 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2024)
|
| Presentation Title |
Laser Powder Bed Fusion Copper: Post-Processing, Structure, Property Relationships |
| Author(s) |
Rachel Paddock, Pouria Khanbolouki, Saniya LeBlanc, Michael Cullinan, Mehran Tehrani |
| On-Site Speaker (Planned) |
Rachel Paddock |
| Abstract Scope |
Copper is used for a variety of electrical and thermal applications due to its exceptional physical and mechanical properties. There is a growing interest in alternatives to manufacture intricate copper parts. Additive manufacturing not only offers a substitute to traditional manufacturing methods, but also allows for optimizing designs that are otherwise difficult or impossible to make. In this research, we made copper samples using an EOS M280 laser powder bed fusion (LPBF) system. One of the greatest challenges with using LPBF for copper is the undesired structure and low density of the printed parts. To combat this challenge, we subjected the samples to annealing or hot isostatic pressing (HIP) to improve the material’s properties. This research highlights the electrical, thermal, and mechanical properties and correlates these results to the microstructure of the copper samples. Based on these results, recommendations are given for printing and post-processing copper using LPBF. |
| Proceedings Inclusion? |
Definite: Post-meeting proceedings |