About this Abstract |
Meeting |
2024 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2024)
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Symposium
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2024 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2024)
|
Presentation Title |
Confined Direct Two-phase Jet Impingement Cooling with Topology Optimized Surface Engineering and Phase Separation Using Additive Manufacturing |
Author(s) |
Harish Kumar Lattupalli, Md Asif Iqbal, Emily Cyr, Sina Ghadi, Scott Schiffres |
On-Site Speaker (Planned) |
Sina Ghadi |
Abstract Scope |
This poster presents an innovative approach to address the growing energy challenge in data centers, focusing on cooling efficiency. Our project targets less than 5% of total energy consumption for cooling and aims to eliminate water usage by developing an energy-efficient two-phase cooling system. We introduce a unique two-phase wick structure with a thermal resistance below 0.01 K/W, designed to be directly printed on chips without the need for thermal interface materials, using a novel inter-material. To enhance cooling for high-power chips essential for AI, we've optimized the heatsink design through topology optimization. Our process development studies have fine-tuned wick porosity and microstructure, with validation through SEM, optical microscopy, and CT scans. An optimized manifold has been designed for uniform flow distribution using vat polymerization. Test artifacts were fabricated to set design parameters and evaluate coolant material compatibility. |
Proceedings Inclusion? |
Definite: Post-meeting proceedings |