|About this Abstract
||2022 TMS Annual Meeting & Exhibition
||Late News Poster Session
||C-4: Correlation between Crystallographic Microstructure of Electrodeposits and Adsorption of Additives through Electrochemical Calculations at Feature Scale
||Han-Kyun Shin, Yeon-Soo Jung, Hyun Park, Hyojong Lee
|On-Site Speaker (Planned)
Electroplating technology has been used for filling damascene and PCB patterns having a scale of several nanometers to several hundreds of micrometers. In terms of mass transfer in aqueous solution, copper ions, Cl-, and organic additives are known to have a diffusion coefficient of ~10-10 m2s-1, which can be inferred to have an average moving distance of ~10 µm per second. It can be expected that the concentration gradient of these materials in the pattern is not large at the nanoscale, and in filling the nanoscale pattern, the competitive adsorption of organic additives is important. However, when the pattern scale is tens of micrometers or more, the concentration gradient inside the pattern by mass transfer plays an important role. Here, we try to explain the crystallographic microstructure measured through EBSD in connection with the electrochemical calculation results in PCB and TSV patterns.
||Electronic Materials, Copper / Nickel / Cobalt, Electrometallurgy