| Abstract Scope |
Miniaturization, intelligence, and multifunctionality have become hallmarks of electronic products over the past few decades. The development of new energy vehicles and 5G mobile communication technologies may continuously alter the service conditions of Sn-based solder, the most commonly used interconnecting material in the microelectronic industry. Sn-based composite solders have recently gained popularity due to their improved mechanical properties. In our work, to enhance the stability and mechanical performance of the Sn-3.0Ag-0.5Cu solder joint during multiple reflows and isothermal aging at 200°C, nickel-coated carbon fibers (Ni@CFs) were used as reinforcement inside the joint. We investigated the evolution of thickness, growth kinetics, and grain structure of interfacial intermetallics (IMC), as well as shear strength and fracture mode of Ni@CFs-reinforced solder joint. It aims to provide an essential foundation for designing and manufacturing microelectronic interconnection structures with high-reliability and high-performance based on the interfacial reaction and growth kinetics of IMCs. |