|About this Abstract
||MS&T23: Materials Science & Technology
||Interface-mediated Phenomena in Structural Materials
||Diffusion Bonding of Titanium to Vanadium
||Bernard Gaskey, Sara Ricci, Cody Miller, Saryu Fensin, John Carpenter
|On-Site Speaker (Planned)
Diffusion bonding is an important technique for joining high precision metal parts without localized heating or introduction of additional materials or interlayers. This is especially applicable in fields like aerospace manufacturing, where dimensional tolerances can be very tight and material selection is limited. Some dissimilar metal pairs are incompatible for diffusion bonding, and others may only be bonded over a specific temperature range due to phase transformations, especially including the formation of deleterious intermetallic compounds. Specifically, in the case of Ti-V bonding couples, we show that crack-free bonds are only formed at temperatures below the β transus temperature of the Ti alloy used. For pure Ti, this means that only a small range of bonding temperatures exists, whereas for some Ti alloys the temperature range is significantly wider. This study provides a framework for designing diffusion bonding processes between Ti alloys and the family of β-stabilizing refractory alloys.