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Meeting 13th International Conference on the Technology of Plasticity (ICTP 2021)
Symposium 13th International Conference on the Technology of Plasticity (ICTP 2021)
Organizer(s) Glenn S. Daehn, Ohio State University
Libby D. Culley, The Ohio State University
Anupam Vivek, Ohio State University
Jian Cao, Northwestern University
Brad Kinsey, University of New Hampshire
Erman A. Tekkaya, TU Dortmund
Yoshinori Yoshida, Gifu University
Scope The International Conference on the Technology of Plasticity (ICTP) represents one of the biggest international events in metal forming technology. ICTP 2021 attendees will provide presentations on a variety of metal forming topics, including improvements and innovations in all major areas of the technology and science of metal forming. Although the organizers will fully develop the technical program, some topical areas will likely include forming processes, materials characterization and testing, computational modeling, and process control. An underlying theme of ICTP 2021 will be sustained manufacturing, as it relates to metal forming. Presentations that show a direct impact on industrial applications as well as fundamental science underpinnings will be encouraged. An emphasis on collaborative work will seek to further promote links between government organizations and institutes, academia, and industry (both producers and users of formed products). This 2021 event builds upon the solid foundation provided in the first twelve iterations of this international conference, which was founded in 1984, has been held every three years since, and has often been referred to as the “Olympics of Metal Forming”.
Abstracts Due 09/01/2020
Proceedings Plan Definite: At-meeting proceedings
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